Okokuqala siza kucacisa ngesihloko sethu, oko kukuthi, kubaluleke kangakanani uyilo lwePCB kwinkqubo yesiqwenga se-SMT.Ngokunxulumene nomxholo esiwuhlalutye ngaphambili, sinokufumanisa ukuba uninzi lweengxaki zekhwalithi kwi-SMT zihambelana ngqo neengxaki zenkqubo yangaphambili.Kufana nje nombono “we-deformation zone” esiyibeke phambili namhlanje.
Oku ikakhulu kwePCB.Logama nje umphezulu ongezantsi we-PCB ugobile okanye ungalingani, i-PCB inokugotywa ngexesha lenkqubo yokufaka isikrufu.Ukuba izikrufu ezimbalwa ezilandelelanayo zisasazwa kumgca okanye kufutshane nendawo efanayo yophando, i-PCB iya kugoba kwaye ikhubazeke ngenxa yesenzo esiphindaphindiweyo soxinzelelo ngexesha lolawulo lwenkqubo yokufakela isikrufu.Sibiza le ndawo egobileyo ngokuphindaphindiweyo indawo yokuguqulwa.
Ukuba i-chip capacitors, i-BGAs, iimodyuli, kunye nezinye izinto ezithintekayo zokutshintsha uxinzelelo zibekwe kwindawo yokuguqulwa ngexesha lenkqubo yokubeka, ngoko i-solder joint ayinakuqhekeka okanye iphulwe.
Ukuqhekeka kwe-modyuli yonikezelo lwamandla edibeneyo kule meko yile meko
(1) Kuphephe ukubeka amacandelo uxinezeleko-sensitive kwiindawo ekulula ukugoba kwaye deform ngexesha PCB indibano.
(2) Sebenzisa isixhobo sokwenza isibiyeli esisezantsi ngexesha lenkqubo yokuhlanganisa ukuze uthambise iPCB apho isikrufu sifakwe khona ukuthintela ukugoba kwePCB ngexesha lokuhlanganisa.
(3) Ukuqinisa i-solder joints.
Ixesha lokuposa: May-28-2021
