W25Q64JVSSIQ IFLASH engaguquguqukiyo 64Mb (8M x 8) SPI – Dual/Quad I/O SOP-8_208mil NOR FLASH RoHS

Inkcazelo emfutshane:

Inxalenye ye-Mfr:W25Q64JVSSIQ

Umenzi: Winbond

Iphakheji:SMD

Inkcazelo:NOR Flash spiFlash, 64M-bit, 4Kb iCandelo eliFanayo

Icwecwe ledatha:Nceda uqhagamshelane nathi.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

IParameter yeMveliso

Iinkcukacha
Uphawu	Ixabiso
Umenzi:	Winbond
Udidi lweMveliso:	AKUKHO Flash
RoHS:	Iinkcukacha
Isimbo sokuNqamisa:	SMD/SMT
Umqulu / Ityala:	I-SOIC-8
Uthotho:	I-W25Q64JV
Ubungakanani benkumbulo:	64 Mbit
Supply Voltage - Min:	2.7 V
Ubonelelo lweVoltage-Max:	3.6 V
Ukufunda Okusebenzayo Ngoku - Ubuninzi:	25 mA
NONE	SPI
Ubuninzi bewotshi yokuphindaphinda:	133 MHz
Umbutho:	8 Mx 8
Ububanzi bebhasi yeDatha:	8 bit
Uhlobo lwexesha:	Ungqamaniso
Ubuncinci bobushushu bokusebenza:	- 40 C
Obona bushushu bokusebenza:	+ 85 C
Ukupakishwa:	Itreyi
Uphawu:	Winbond
Unikezelo lwangoku - Ubuninzi:	25 mA
Ukungevani kukufuma:	Ewe
Uhlobo lweMveliso:	AKUKHO Flash
Ubungakanani bePakethi yoMzi-mveliso:	630
Uluhlu olungaphantsi:	Imemori kunye noGcino lweDatha
Igama loRhwebo:	SpiFlash
Ubunzima beyunithi:	0.006349 oz

Iinkcukacha zeMveliso

Iimbonakalo:
* Usapho olutsha lweeMemori zeSpiFlash-W25Q64JV: 64M-bit / 8M-byte
– ISPI esemgangathweni: CLK, /CS, DI, DO
– Dual SPI: CLK, /CS, IO0, IO1
– I-Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – ISoftware & Ukusetwa kwakhona kweHardware(1)
* IFlash yothotho lwentsebenzo ephezulu
– 133MHz iiwotshi eziNye, ezimbini/ezine-SPI
266/532MHz ilingana Dual/Quad SPI
– Min.Imijikelo ye-100K yeNkqubo-Erase kwicandelo ngalinye - Ngaphezulu kweminyaka engama-20 yokugcinwa kwedatha
*Esebenzayo "Ukufunda ngokuqhubekayo"
-Funda ngokuqhubekayo nge-8/16/32/64-Byte Wrap-Kangangeewotshi ezisi-8 ukulungisa inkumbulo
-Ivumela ukusebenza kweXIP yokwenyani (yenza endaweni) -Isebenza ngokugqwesa iX16 Parallel Flash
* Amandla aphantsi, i-Wide Temperature Range - I-2.7 eyodwa ukuya kwi-3.6V yokubonelela
- <1μA Amandla-ezantsi (uhlobo.)
- -40 °C ukuya +85 °C uluhlu lokusebenza
* I-Flexible Architecture enamacandelo e-4KB
-Icandelo elifanayo / iBlock Erase (4K/32K/64K-Byte) – Inkqubo 1 ukuya kwi-256 byte ngephepha elicwangcisiweyo – Cima/iNkqubo Gxilisa kwaye uqalise kwakhona
* Iimpawu zoKhuseleko oluPhezulu
-Isoftware kunye neHardware Bhala-Khusela
– Ukhuseleko olukhethekileyo lwe-OTP(1)
– Phezulu/Ezantsi, Ukuzalisekisa ukukhuselwa koluhlu – Ibhloko yomntu ngamnye/iCandelo lokhuselo loluhlu
-I-64-Bit Eyodwa ye-ID yesixhobo ngasinye
– IRejista yeeParamitha ezifumanekayo (i-SFDP) – iirejista zoKhuseleko ze-3X256-Bytes
-Iibhithi zoBhaliso eziguquguqukayo nezingaguquguqukiyo
* Ukupakishwa ngokufanelekileyo kwisithuba
– 8-pin SOIC 208-mil / VSOP 208-mil
– 8-pad WSON 6x5-mm/8x6-mm, XSON 4x4-mm – 16-pin SOIC 300-mil
– 8-pin PDIP 300-mil
-Ibhola engama-24 TFBGA 8x6-mm (6x4 uluhlu lwebhola)
-Ibhola engama-24 TFBGA 8x6-mm (6x4/5x5 uluhlu lwebhola)
-Qhagamshelana neWinbond ye-KGD kunye nolunye ukhetho