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Impembelelo yeteknoloji yonyango lwe-PCB kumgangatho we-welding

Unyango lomphezulu we-PCB ngundoqo kunye nesiseko somgangatho we-SMT patch.Inkqubo yonyango yale khonkco ibandakanya ikakhulu la manqaku alandelayo.Namhlanje, ndiza kwabelana nawe ngamava obungqina bebhodi yesekethe:
(1) Ngaphandle kwe-ENG, ubukhulu bomgca we-plating abuchazwanga ngokucacileyo kwimigangatho yesizwe echaphazelekayo yePC.Kufuneka kuphela ukuhlangabezana neemfuno ze-solderability.Iimfuno jikelele zolu shishino zezi zilandelayo.
I-OSP: 0.15 ~ 0.5 μm, ayichazwanga yi-IPC.Kucetyiswa ukuba kusetyenziswe 0.3 ~ 0.4um
EING: Ni-3~5um;Au-0.05~0.20um (I-PC ichaza kuphela eyona mfuno yangoku ithinne)
I-Im-Ag: 0.05 ~ 0.20um, i-furter, i-corrosion inzima kakhulu (i-PC ayichazwanga)
Im-Sn: ≥0.08um.Isizathu sokutyeba kukuba i-Sn kunye ne-Cu iya kuqhubeka nokuphuhlisa kwi-CuSn kwiqondo lokushisa, elichaphazela ukuthengiselana.
I-HASL Sn63Pb37 ngokuqhelekileyo yenziwe ngokwendalo phakathi kwe-1 kunye ne-25um.Kunzima ukulawula ngokuchanekileyo inkqubo.I-lead-free ikakhulu isebenzisa i-alloy ye-SnCu.Ngenxa yobushushu bokusebenza okuphezulu, kulula ukwenza i-Cu3Sn ngesandi esibi solderability, kwaye ayisasetyenziswa ngoku.

(2) Ukumanzisa kwi-SAC387 (ngokwexesha lokumanzisa phantsi kwamaxesha ahlukeneyo okufudumeza, iyunithi: s).
0 amaxesha: im-sn (2) florida ukuguga (1.2), osp (1.2) im-ag (3).
I-Zweiter PLENAR ISESHINI I-Im-Sn ineemeko ezingcono zokuxhathisa umhlwa, kodwa ukuxhathisa kwayo kwi-solder kumbi kakhulu!
Amaxesha ama-4: ENG (3)-ImAg (4.3)-OSP (10)-ImSn (10).

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(3) Ukumanzisa kwi-SAC305 (emva kokudlula eziko kabini).
XHOSA (5.1)—Im-Ag (4.5)—Im-Sn (1.5)—OSP (0.3).
Ngapha koko, abantu abangenamdla banokubhideka kakhulu kwezi parameters zobungcali, kodwa kufuneka iqatshelwe ngabavelisi bobungqina be-PCB kunye nokukhwela.


Ixesha lokuposa: May-28-2021