UKUTHUNYELWA SIMAHLA KUZO ZONKE IIMveliso ZEBUSHNELL

Impembelelo yetekhnoloji yonyango yomphezulu we-PCB kumgangatho we-welding

Unyango lomphezulu we-PCB sisitshixo kunye nesiseko somgangatho wepatch ye-SMT. Inkqubo yonyango lwale khonkco ikakhulu ibandakanya la manqaku alandelayo. Namhlanje, ndiza kwabelana ngamava kwibhodi yesekethe yobungcali kunye nawe:
(1) Ngaphandle kwe-ENG, ubukhulu be-plating layer abuchazwanga ngokucacileyo kwimigangatho efanelekileyo ye-PC. Kufuneka kuphela ukuhlangabezana neemfuno zokuthengiswa. Iimfuno ngokubanzi zeshishini zezi zilandelayo.
I-OSP: 0.15 ~ 0.5 μm, ayichazwanga yi-IPC. Kuyacetyiswa ukuba kusetyenziswe i-0.3 ~ 0.4um
Ukutya: Ni-3 ~ 5um; I-Au-0.05 ~ 0.20um (i-PC ichaza kuphela imfuno yangoku ye-thinnest)
I-Im-Ag: 0.05 ~ 0.20um, ukujiya, kokubi ngakumbi ukubola (PC ayichazwanga)
Im-Sn: -0.08um. Isizathu sokujiya kukuba uSn noCu baya kuqhubeka nokukhula babe yiCuSn kubushushu begumbi, obuchaphazela ukuthengiswa.
I-HASL Sn63Pb37 yenziwa ngokwendalo phakathi kwe-1 kunye ne-25um. Kunzima ukulawula ngokuchanekileyo inkqubo. Ayinazikhokelo ngaphandle isebenzisa i-SnCu alloy. Ngenxa yeqondo lobushushu eliphezulu lokuqhubekeka, kulula ukwenza i-Cu3Sn enesandi esibi sokuthengisa, kwaye ayisetyenziswanga ngoku.

(2) Ubumanzi kwi-SAC387 (ngokwexesha lokumanzisa phantsi kwamaxesha ahlukeneyo okufudumeza, iyunithi: s).
Amaxesha angama-0: im-sn (2) ukuguga kwe-florida (1.2), osp (1.2) im-ag (3).
I-Zweiter PLENAR SESSION I-Zweiter PLENAR SESSION I-Im-Sn ineyona nto inokumelana ne-corrosion, kodwa i-solder yayo yokumelana nayo ihlwempuzekile!
Amaxesha ama-4: ENG (3) -ImAg (4.3) -OSP (10) -ImSn (10).

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(3) Ubumanzi kwi-SAC305 (emva kokudlula kwiziko kabini).
ENG (5.1) -Im-Ag (4.5) -Im-Sn (1.5) -OSP (0.3).
Ngapha koko, i-amateurs inokudideka kakhulu kwezi paramitha zobuchwephesha, kodwa kufuneka iqatshelwe ngabavelisi bokubonisa ubungqina bePCB kunye nokufaka amatyeli.


Ixesha Post: May-28-2021